TCS Launches Chiplet-Based Engineering Services To Boost Semiconductor Innovation | Business News


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‘Our chiplet-based engineering services will give semiconductor firms the flexibility and scalability they need to bring next-gen processors to market faster,’ says a TCS official.

TCS said it has been working with a North American semiconductor firm to integrate multiple chiplets into single systems, helping speed up the delivery of AI processors.

TCS said it has been working with a North American semiconductor firm to integrate multiple chiplets into single systems, helping speed up the delivery of AI processors.

Tata Consultancy Services (TCS) on September 11 announced the launch of its chiplet-based system engineering services to help semiconductor companies design faster and more powerful processors. Shares of the IT services major were trading higher by 0.08% to trade at Rs 3,112 apiece on the NSE, as of 11:54 am.

Chiplets, which are smaller integrated circuits that can be combined to form advanced chips, are gaining traction as traditional methods of shrinking transistors reach their limits. The new design approach allows manufacturers to mix and match different chiplets, cutting costs and accelerating product launches.

“The semiconductor industry is moving beyond the traditional model of cramming more transistors into a single chip,” said V Rajanna, president (technology, software and services) of TCS. “Our chiplet-based engineering services will give semiconductor firms the flexibility and scalability they need to bring next-generation processors to market faster.”

India’s semiconductor market, estimated at $45-50 billion in 2024–25, is expected to more than double to around $100-110 billion by 2030, according to industry projections. The government has also set up a Rs 76,000-crore India Semiconductor Mission to encourage global and domestic players to invest in chip design and manufacturing. Already, India accounts for roughly 20% of the world’s chip design talent.

TCS said it has been working with a North American semiconductor firm to integrate multiple chiplets into single systems, helping speed up the delivery of AI processors. The company’s offerings include design and verification of UCIe™ (Universal Chiplet Interconnect Express) and HBM (High Bandwidth Memory), along with advanced packaging services such as 2.5D and 3D interposers.

The launch comes at a time of surging global demand for semiconductors, driven by artificial intelligence, smartphones, cloud computing, electric vehicles and connected devices. Industry analysts say the shift to chiplet-based design could be a crucial factor in meeting these requirements while keeping costs in check.

Mohammad Haris

Mohammad Haris

Haris is Deputy News Editor (Business) at news18.com. He writes on various issues related to personal finance, markets, economy and companies. Having over a decade of experience in financial journalism, Haris h…Read More

Haris is Deputy News Editor (Business) at news18.com. He writes on various issues related to personal finance, markets, economy and companies. Having over a decade of experience in financial journalism, Haris h… Read More

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