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Taiwan’s Foxconn and India’s HCL Group formed a joint venture to set up an Outsourced Semiconductor Assembly & Test (OSAT) facility in Greater Noida.
PM Modi launching then HCL-Foxconn semiconductor facility in UP.
Prime Minister Narendra Modi on Saturday laid the foundation stone of the HCL-Foxconn semiconductor facility in Uttar Pradesh, calling it a key milestone for the nation’s self-reliance in semiconductor chips.
“We are proud that Uttar Pradesh is becoming a part of the semiconductor ecosystem in the country. This semiconductor unit will give new recognition to the state. Moreover, it will boost employment, as the establishment of a semiconductor facility attracts ancillary industries, which will ultimately generate more jobs,” Modi said in a virtual address.
Taiwan’s Foxconn and India’s HCL Group formed a joint venture, called India Chip Private Limited, to set up an Outsourced Semiconductor Assembly & Test (OSAT) facility at YEIDA (Yamuna Expressway Industrial Development Authority) in Greater Noida. The advanced facility is expected to be operational by 2028.
In his address, PM Modi said a weak supply chain of tiny chips during the Covid-19 pandemic halted development of several economies and stopped work at various factories. “Developed India will be built only when India is self-reliant. For this, Made in India chip is very important. Whatever India is doing in the field of technology in this decade, it will become foundation of our capability in the 21st century,” Modi said.
The establishment of the HCL-Foxconn semiconductor facility in Uttar Pradesh is a step towards technological self-reliance. It will boost India’s presence in the global chip ecosystem.https://t.co/DNY4D9MDUz— Narendra Modi (@narendramodi) February 21, 2026
The Prime Minister also said four semiconductor units, out of the ten approved under the India Semiconductor Mission, are set to begin production in the country. “If India’s chips are made in India, we will not have to rely on others for the tech manufacturing needs. Digital India, semiconductor chips, EVs, 5G, and AI are the soul of everyday needs. If we have chips of our own, our progress in every sector will remain unimpeded,” he said.
HCL Group has earmarked an investment of Rs 3,700 crore over the next few years in the facility that will produce display driver chips. The investment is expected to create over 3,500 direct and indirect jobs, build local supply chains, and attract ecosystem partners across the semiconductor value chain.
UP Chief Minister Yogi Adityanath and Union IT Minister Ashwini Vaishnaw were also present on the occasion. They were joined by Roshni Nadar Malhotra, chairperson, HCL Group, and Bob Chen, president (semiconductor business group), Hon Hai Technology Group (Foxconn).
“In the last 11 years, the Prime Minister has established India as a powerhouse of electronics manufacturing. India is now ranked third among nations that export electronics. In a month, 3.6 crore chips will be produced from this plant. The brain of the digital screens that you see will now be made in Jewar,” Union Electronics and IT Minister Ashwini Vaishnaw said.
HCL Group Chairperson Roshni Nadar said the joint venture facility will cater to the requirements of both domestic and international markets. Bob Chen also addressed the event, saying, “We want to establish reliable semiconductor assembly and testing facility in India. We look forward to growing together and contributing to India’s growth in global technology landscape.”
(with inputs from PTI)
February 21, 2026, 18:54 IST
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